Chip Scale Review is the definite authority regarding everything in the fields of Chips Scale Electronics, flip-chip technology, optoelectronic interconnection and waifer-level packaging. The magazine is recognized by professionals as the top publication in those fields. The international journal’s goal is to forward the the latest semiconductor packaging technologies' growth influencing the design assembly and the manufacturing using chip-scale electronics. The timely coverage, expert commentary, analysis and in-depth features focused on electronic packaging, interconnection, and systems have attracted more than 23,000 engineers, specialists, researchers, and end users of chip-scale electronics from all over the world. Chip Scale Review magazine is published 8 times per year by Gene Selven.
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